Moderate evidenceIndustry-fundedSystematic review with Bayesian hierarchical modeling

How much more common did telogen effluvium (stress- or illness-triggered diffuse hair shedding) become worldwide because of the COVID-19 pandemic?

DraftJAAD International · Sept 2024 · checked 17 Oct 2026

COVID-19-related illness and stress caused a real, measurable worldwide rise in diffuse hair shedding, not just anecdotally -- useful context for anyone who noticed heavier shedding roughly 2-4 months after a COVID infection or other major illness/stress, since this pattern typically resolves on its own within 6-12 months.

Who was studied
90 studies from 26 countries
Type of study
Systematic review with Bayesian hierarchical modeling
Evidence
Moderate

What they did

Systematically reviewed 90 global studies (searched through March 2024) reporting telogen effluvium rates, then statistically modeled worldwide and regional prevalence before versus after the pandemic began, using a Bayesian hierarchical model.

What they found

Global telogen effluvium prevalence rose from an estimated 3.44% before the pandemic to 5.41% after it -- roughly a 1.6-fold increase. Regional rates ranged from 2.83% (high-income North America) to 11.11% (East Asia); the lowest country-level estimate was the US (2.08%) and the highest was China (13.33%). Women were affected far more often than men.

Limitations

Most included studies were based on outpatient dermatology clinic visits, which may not reflect the general population (many people with shedding never see a doctor); the review could not reliably separate 'acute' (temporary) from 'chronic' telogen effluvium cases; no dengue-specific telogen effluvium data were identified in this review or elsewhere during this research.

Who paid for it

Korea Medical Institute research program; National Research Foundation of Korea grant RS-2023-00249120 (academic, non-industry)

Read the original

Global epidemiology of telogen effluvium after the COVID-19 pandemic: A systematic review and modeling study ↗ · Jeon JJ, Kim YH, Kang H, Ha MC, Jung SW, Son H, Kim MH, Lee WS, Lee S · DOI 10.1016/j.jdin.2024.08.018

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